• Wafer Cleaner

    Global Innovation to NeonTech

(a) System introduction.
  • 8”,12”Wafer wet spin cleaning
  • Low level Clean room (10~100 class)
(b) System summary.
  • 8”12”simple Conversion
  • Dual spin cleaning UPH UP.
  • Cleaning condition Optimize nozzle
  • D.I Wafer jet type Cleaning (Co2 Bubbler)
(c) System dimension.
  • 1,420x1,900x1,850mm(W x D x H)

SPECIFICATIONS

Specification Unit NSDA-6000
Workpiece Size
Cassettes Inch 8” cassettes / 12”cassettes
Frame Inch 8”,12”
Cleaning target
Work Range mm 200~300
Actuator Type - Clean type
S-Axis
Cleaning Area mm Max 300
Max Speed rpm Max 2,500
Nozzle
Work Range Inch Max 12” Within the area UI control
Nozzle Type - Air Blow, Air Atomizing
Nozzle Moving Parameter - Speed & angle
Options
Air Volume (Max) cmm 3.5
Air Velocity (Max) m/s 0.2
Utilities
Power vac 220VAC – 3P - 30A 50/60Hz
Air Pressure kg/cm2 5 ~ 6
Water Pressure kg/cm2 3 ~ 4
Exhaust m3/min >50
Suction Motor m3/min >28 x 2ea
Weight kg @ 1,300
Size(W x D x H)mm mm 1,300x1,900x1,900
Automation Equipment and
Consumables Semiconductor Equipment Business Technical Sales Team

Equipment Technical Sales Team
sales@neontech.co.kr
Tel : 070-5090-2081~2085