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Manual Wafer/Substrate Mounting System

NTM-80
  • Manual wafer /substrate mounting system to ring frame.
  • Spring tension mechanism on chuck to prevent material damage.
Work Flow
  • Loading (Wafer & Ring frame) → Tape mounting → Tape cutting → Unloading
Main Features
  • 6” & 8” wafer(NTM-60/80) or substrate mounting
  • Manual tape mounting & cutting
  • Tape tension control(Anti tape loosen)
  • Cover tape auto rewinding
  • Temperature programmable chuck (Vacuum chuck)
  • Spring tension mechanism on chuck to prevent wafer broken

SPECIFICATIONS

Items Specifications
1 Material size ø200mm
2 Temperature control 30 ~ 60 degr
3 Material surface protection Vacuum chuck teflon coating
4 Tape max width 330mm
5 Cover film Auto rewinding function
6 dimension (W x D x H) 420 x 800 x 370mm
7 Weight 35 Kg
8 Lamp life time 3,000H
9 Vacuum 0.3 MPa
10 Electricity 220V 50/60Hz 15A
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소모품 관련 반도체 장비 사업부 기술영업팀

장비기술영업팀
sales@neontech.co.kr
Tel : 070-5090-2081~2085