• Tape Mount

    Global Innovation to NeonTech

Full Automatic Tape Mounting System

NFTM-3200
  • Wafer/substrate mounting system to ring frame(circle or square)
Work Flow
  • Cassettes loading → Ring frame loading & align → Material loading → Tape mounting → Mounting tape cutting → Ring frame unloading to cassette
System Stability
  • PC base graphic user interface.
  • Support various material size : Up to 10”
  • Support various mounting material.
  • Fast mounting speed : 10 sec/EA.
  • Programmable tape mounting recipe (speed, Z-axis height)

SPECIFICATIONS

Wafer Dicing Tape Mount System – NFTM-3200
Work Material Size Up to 10
Tape Size 210mm~270mm
Thickness 0.13~1.2mm(T)
Typical Mounting Speed 30~60mm/sec
Magazine Semi Standard
Picker Y-Unit Vacuum Pad
Motor Power 200W
Ring Frame Checker Vacuum Sensing
Workpiece Checker Vacuum Sensing
Index Step 0.1mm
Picker Z-Unit Vacuum Pad
Motor Power 100W
Ring Frame Checker Vacuum Sensing
Work Piece Checker Vacuum Sensing
Index Step 0.1mm
Unloading Picker Z-Unit Motor Power 100
Max Speed 100mm/sec
Index Step 0.1mm
Unloading Y-Unit Motor Power 100W
Max Speed 100mm/sec
Index Step 0.1mm
Cassette Loading Unit Motor Power 100W
Max Speed 100mm/sec
Index Step 0.1mm
Utility Utility 220VAC, 3-phase, 50/60Hz
Air Supply 5.0 ~ 6. 0 kgf/cm2, 3Line(dia:10mm)
Dimension(WxDxH) 1,900 x 1,850 x 1,650mm
Weight 1,300Kg
Automation Equipment and
Consumables Semiconductor Equipment Business Technical Sales Team

Equipment Technical Sales Team
sales@neontech.co.kr
Tel : 070-5090-2081~2085