• Breaker

    Global Innovation to NeonTech

Full Automatic Sapphire Breaker System

Fully Automated Wafer Breaking Series
  • Sapphire wafer breaking system for LED chip separation
Powerful Breaking Engine
  • NEONTECH’s unique breaking blade synchronized with electrical small hammer. Breaking speed and hammer hit force is controlled and optimized for various laser scribing condition.
Various Function
  • Multiple align & breaking method(continuous or odd/even breaking) Broken wafer semi automatic breaking.
User Interface
  • Multi language such as Korea / English / Chinese / Japanese Is provided for user’s convenience. Also, system provide wide(17”) screen.

SPECIFICATIONS

Specification Unit NBK-106H NBK-107H
Workpiece size Inch Φ4” Φ6”
X-axis
Moving Range mm 0.01 – 110 0.01 – 160
Moving Speed mm/sec 0.1 – 400
Y-axis
Indexing Range mm 110 160
Y-Single Pitch Error mm 0.002/5
Y-Positioning Error mm 0.002/110 0.002/160
Min.Step mm 0.0001
Z-axis
Max Stroke mm 100
Moving Resolution mm 0.00005
Repeatability accuracy mm 0.001
Θ-axis Max Rotation Angle deg 360
Support Axis
Work Range mm 45 65
Resolution mm 0.001
Machine Dimensions(WxDxH) mm 1,050 x 1,080 x 1,800 1,190 x 1,200 x 1,800
Machine Weight kg 800 1,000
Automation Equipment and
Consumables Semiconductor Equipment Business Technical Sales Team

Equipment Technical Sales Team
sales@neontech.co.kr
Tel : 070-5090-2081~2085